PropertiesGrade

CuNi1

CuNi2

CuNi6

CuNi8

CuMn3

CuNi10

Main Chemical Composition

Ni

1

2

6

8

_

10

Mn

_

_

_

_

3

_

Cu

Bal

Bal

Bal

Bal

Bal

Bal

Max Continuous Service Temperature（°C） 

200

200

200

250

200

250

Resisivity at 20°C (Ωmm2/m)

0.03

0.05

0.10

0.12

0.12

0.15

Density(g/cm3)

8.9

8.9

8.9

8.9

8.8

8.9

Thermal Conductivity(α×10-6/°C)

<100

<120

<60

<57

<38

<50

Tensile Strength(Mpa)

≥210

≥220

≥250

≥270

≥290

≥290

EMF vs Cu(μV/°C)(0~100°C)

-8

-12

-12

-22

_

-25

Approximate Melting Point( °C)

1085

1090

1095

1097

1050

1100

Micrographic Structure

austenite

austenite

austenite

austenite

austenite

austenite

Magnetic Property

non

non

non

non

non

non

PropertiesGrade

CuNi14

CuNi19

CuNi23

CuNi30

CuNi34

CuNi44

Main Chemical Composition

Ni

14

19

23

30

34

44

Mn

0.3

0.5

0.5

1.0

1.0

1.0

Cu

Bal

Bal

Bal

Bal

Bal

Bal

Max Continuous Service Temperature（°C） 

300

300

300

350

350

400

Resisivity at 20°C (Ωmm2/m)

0.20

0.25

0.30

0.35

0.40

0.49

Density(g/cm3)

8.9

8.9

8.9

8.9

8.9

8.9

Thermal Conductivity(α×10-6/°C)

<30

<25

<16

<10

<0

<-6

Tensile Strength(Mpa)

≥310

≥340

≥350

≥400

≥400

≥420

EMF vs Cu(μV/°C)(0~100°C)

-28

-32

-34

-37

-39

-43

Approximate Melting Point( °C)

1115

1135

1150

1170

1180

1280

Micrographic Structure

austenite

austenite

austenite

austenite

austenite

austenite

Magnetic Property

non

non

non

non

non

non